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Tin and Tin-Lead

Tin and Tin-Lead

Tin and tin-lead electroplating involves depositing a solderable tin or tin-lead plating onto the substrate via an electric current. CTI performs both bright and matte tin and the tin-lead is a 90:10 ratio. Substrates plated are majority copper but can also be brass and phosphorus bronze. The bright tin and tin-lead processes are performed on automatic line to maximize efficiency and output. Advantages of tin plating include excellent solderability and good corrosion resistance.

Specifications and Standards:

■ ASTM B545
■ MIL-P-81728


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